By Joseph S. Heyman
This e-book examines electronics reliability and size expertise. It identifies advances in size technology and know-how for nondestructive overview, and it information universal dimension hassle spots.
Read or Download Electronics Reliability and Measurement Technology - Nondestructive Evaluation PDF
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Additional info for Electronics Reliability and Measurement Technology - Nondestructive Evaluation
Sample text
We will first summarize trends in surface analysis for integrated circuits, high density interconnection boards, and magnetic disks, emphasizing on-line applications as opposed to off-line or development techniques. We will then look more closely at microcontamination detection from both a patterned defect and a particulate inspection point of view. Tma% insurface analysis While the critical problem of the week on a given manufacturing line will fluctuate dramatically, taken over time there are at least five types of measurements that are key to yield and productivity today, and which will tend to gate future manufacturing capability.
H. Propst, C. Bagnell, E. Cole, B. Davies, and W. Oxford, SRC Quarterly Report, March 1984. A. DiBianca, C. Bagnell, E. Cole, D. Johnson, and Cf. Oxford, Scanning Electron Microscopy, Inc. I, 57 (1986). C. Wells, Appl. Phys. Lett. 14, 5 (1969). M. Taylor, J. Phys. D 11, 2443 (1978). C63L. Kotorman, Scanning Electron Microscopy, Inc. IV, 77 (1980). [71K. Ura, H. Fujioka, and K. Nakamae, Scanning Electron Microscopy, Inc. III, 1061 (1982). E. Menzel and E. Kubalek, Scanning 5, 103 (1983). [9]H. Seiler, J.
Thus, an entire series of teats could be multiplexed onto a small set of bond pads, increasing the usable scribe lane area. An example of reliability-integration is shown below where standard clectromigration structurea have been implemented. ENSE Integration Wafer Level Test Structure of the Future. of Drivers, Sensing and Calibration Entirely Into the Device. Ten lines can be stressed using live bond pads where 40 pads would have been neceamry in earlier structures. Pad I is the supply voltage.