By Jain Pushkar, Eugene J. Rymaszewski
Thin-Film Capacitors for Packaged Electronics offers with the capacitors of a sought after variety, nonetheless wanted and in a position to holding velocity with the calls for posed through ever better degrees of integration. It spans a variety of issues, from fabrics houses to limits of what is the easiest it is easy to in attaining in capacitor homes to approach modeling to software examples. many of the themes coated are the next:
-Novel insights into primary relationships among dielectric consistent and the breakdown box of fabrics and comparable capacitance density and breakdown voltage of capacitor buildings,
-Electrical characterization ideas for quite a lot of frequencies (1 kHz to twenty GHz),
-Process modeling to figure out sturdy working issues,
-Prevention of steel (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.
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Sample text
Rymas zewski , and A. G. Klopfenstein, "Microelectronics Packaging Handbook ," Chapman and Hall, New York , 2nd ed 1997, (now Kluwer ), vol 2, ch. 12 C. A. , "Electronics Materials Handbook ," ASM International vol. I, section 2, pp. 255-262. pdf 1. N. Humenik, 1. M. Oberschmidt, L. L. Wu, and S. G. Paull , IBM Journal of Research and Development. 36(5 ),935 (1992). P. D. thes is, Rensselaer Polytech . , Troy , NY, 2003 . l. Rymas zewsk i, IEEE Trans . Adv. Packag. 25,454 (2002). P. lain, 1. Y.
Again, the electrical properties varied over a wide range, with several orders magnitude higher leakage current densities than those on Si substrates. 01 1E-3 1E-4 1/ /.... - - - - 1. On 2 mil Cu/PI Sheet 2. On l00V Sheet. - - 3. On BCB Coated 2 mil CulPI Sheet 4. On l 00E Sheet -+- 5. On BCB/l00V Sheet -~- 6. On BCB/l00E Sheet - x- 7. 7. Leakage current density versus applied field strength of the tantalum thin film capacitors fabricated on different substrates. Both SEM and AFM studies showed different surface finishes on these substrates.
Lu, IEEE Trans . Comp o Packag. Technol. 24(3), 526 (2001). 2. However, there are several factors, such as interfacial micro-roughness, deviation from the optimum stoichiometry, and microstructure in the dielectric films, that can degrade the breakdown voltage of a thin-film capacitor from its BOCA values. Some of these factors originate in the capacitor structure and others are the result of a fabrication technique. They are discussed in this chapter; with the experimental emphasis on tantalum oxide films, though the considerations discussed in this chapter hold in general.