By Frank Riley (auth.), Frank Riley (eds.)
The meeting of digital circuit forums has emerged as the most major progress components for robotics and automatic meeting. This entire quantity, that's an edited number of fabric as a rule released in "Assembly Engineering" and "Electronic Packaging and Production", will supply an important reference for engineers operating during this box, together with fabric on Multi Layer forums, Chip-on-board and diverse case stories. Frank J. Riley is senior vice-president of the Bodine company and a global authority on meeting automation.
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Extra resources for The Electronics Assembly Handbook
Example text
Thus, the overall financial consequence of a single defect can be significant. There are also some military specifications that require some form of hole desmear and etchback. Etchback involves not only the removal of smear from the end inner-layer conductors in the hole, but also etching some of the laminate above and below the conductor at the hole's edge. The use of desmearing techniques in multilayer PCB manufacturing is growing. Dr. William Loeb of Rose and Associates estimates that 17 million square feet of multilayer PCBs went through some form of desmearing process in 1980, of which approximately one million square feet were treated with plasma processing.
Aqueous systems require high energy levels to heat wash solutions and dry boards after cleaning. In high-volume operations, drying time can be an inhibiting factor. The solvency of aqueous solutions is demonstrably less effective than solvents for cleaning surface-mount devices. When PCBs were first manufactured in quantity, the flux used was rosin, and deflux- 27 ing was accomplished with solvents. In the late 1960s, environmental concerns, desire for faster soldering speeds, emergence of watersoluble fluxes, and the development of saponifiers for rosin-type flux caused a shift in cleaning equipment preference to aqueous systems.
Flexible substrates are gaining wider use be~ause they allow greater freedom of design and ease of assembly. These flexible substrates are made of copper laminated to thin films of polyimide. Certain physical properties of PCB substrates, particularly the temperature properties of the polymers, limit the usefulness of current products. In addition, processors are looking for lower-cost laminates and improved processing economics as well as waste reduction and control. General Electric's Plastics Group has recently introduced into the PCB marketplace an amorphous thermoplastic resin, Ultem, which makes an excellent substrate material for injection-molded boards.