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2. After placing the solder balls substrate test vehicles were then reflow soldered using a commercial scale six-zone convection reflow oven. The peak reflow temperature was maintained at around 230 °C. A total of eight flexible BGA substrate were reflow soldered. One of them was used as ‘‘as-soldered’’ sample and rest of them were placed in a climatic chamber for thermal ageing. Samples were aged at a constant temperature of 150 °C for up to 1,000 h, with samples taken out at 50, 100, 200, 400, 600, 800 and 1,000 h.

Lyu, Thermal error forecast and performance evaluation for an air-cooling ball screw system. Int. J. Mach. Tools Manuf. 51, 605–611 (2011) Shear Strength and Fracture Surface Studies of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging Under Isothermal Ageing Sabuj Mallik and Ahmed Z. El Mehdawi Abstract Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.

Uk A. Z. E. -C. Yang et al. 1007/978-94-017-8832-8_3, Ó Springer Science+Business Media Dordrecht 2014 31 32 S. Mallik and A. Z. E. Mehdawi 1 Introduction Electronics manufacturing is one of the rapid changing industries in the world. Miniaturization of electronic products is at the heart of this change. Over the last two decades, the electronic manufacturing industries have experienced tremendous pressure to meet the requirements for miniaturized products, particularly, handheld consumer products such as mobile phones, MP3 players etc.

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